Jorge,

Au thickness of .1 or even .5 umeters is not sufficent to cause Au
embrittlement.  I agree with Phil, the initial gold-to-nickel interface or
Ni oxide may be the weak link, not gold embrittlement.

Regards,
Bruce Misner

> ----------
> From:         Jorge Rodriguez[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Wednesday, May 30, 2001 4:39 PM
> To:   [log in to unmask]
> Subject:      [TN] Gold embrittlement
>
> We have a SMT connector with leads that have a minimum of 0.1 micrometers
> of
> gold plating over 1.5 micrometers of nickel underneath. We don't know why
> the solder joint on this component, even though it looks OK,  breaks and
> fractures very easily. I suspect the gold is making the joint very brittle
> but I am not sure. We already checked the oven profile and it looks
> alright.
> From all the components this is the only one we are having problems with.
> Any advice?. Is there a solder paste that help when gold plated components
> are used?
>
>
> Any advice would be appreciated.
>
>
> Jorge Rodriguez
> Process Engineer
> Varian Electronics Manufacturing
> E-mail: [log in to unmask]
>
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