hi,

the initial gold-to-nickel interface may be the week link not gold embrittlement.

phil

-----Original Message-----
From: Craig Hillman [mailto:[log in to unmask]]
Sent: Wednesday, May 30, 2001 2:30 PM
To: [log in to unmask]
Subject: Re: [TN] Package reliabilty...


LCC's bad if ceramic
BGA's fine if plastic substrate (>5000 cycles of 0-100oC)
CSP's can mean lots of things. Do you mean flip-chip or SMT devices with die
>50% of encapsulated area?

Craig

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen R. Gregory
Sent: Wednesday, May 30, 2001 12:50 PM
To: [log in to unmask]
Subject: [TN] Package reliabilty...


Hi ya'll!

Can anyone comment from experience on what you know as a general rule of
thumb to be the least reliable family of components (LCCs vs. 0.8 mm pitch
BGAs/CSPs), both from a thermal cycling point of view and from the repeated
application of physical stress?

'preciate it...

-Steve Gregory-

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