We have a SMT connector with leads that have a minimum of 0.1 micrometers of
gold plating over 1.5 micrometers of nickel underneath. We don't know why
the solder joint on this component, even though it looks OK,  breaks and
fractures very easily. I suspect the gold is making the joint very brittle
but I am not sure. We already checked the oven profile and it looks alright.
From all the components this is the only one we are having problems with.
Any advice?. Is there a solder paste that help when gold plated components
are used?


Any advice would be appreciated.


Jorge Rodriguez
Process Engineer
Varian Electronics Manufacturing
E-mail: [log in to unmask]

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