I was wondering if anyone has had experience performing solder rework on
PCB Assemblies using "IMpcb" (T-lam Insulated Metal Printed Circuit Board)
Board Material made by Thermagon, Inc., of Cleveland, OH.

We have had instances where, in an attempt to replace a component on the
Assy, the pad is lifted off the PCB.

Generally it seems that the copper traces are less adherent with the IMpcb
material than with FR4 material.

Thermagon advises in their literature that solder rework requires that the
PCB Assy be pre-heated because of the high thermal conductivity of the
IMpcb material.  We have not attempted pre-heating the PCB just yet.  I was
just curious whether anyone else had had similar experience with IMpcb
material, especially with solder rework.
Thank you in advance.

Best regards,
Paul Baine
C-Tech Ltd.

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