LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

May 2001

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET May 2001

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	conductive epoxy prepreg
From:	"<Bob Mcgarry>" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 30 May 2001 10:58:08 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (17 lines)

Does anyone know of a electrically and thermally conductive epoxy prepreg that can be used to bond PCB's to heatsinks. Material must be conductive and have the properties of a no-flow type prepreg to avoid flow into gaps in the heatsink.
Thanks,


__________________________________________________________________
Get your own FREE, personal Netscape Webmail account today at http://webmail.netscape.com/

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG