Hi,

The board's type I am dealing with is 3.8 mm thick with 28 layers made of
GETEK raw material. The BGA's rework process had been defined as followed:
Baking the boards for 24 hours at 125C, remove the defected component with
the BGA's rework station, clean the component's area, paste printing, locate
the component on the pads and pass it through the reflow oven under the same
profile definition as the first assembly (because of a big board size- 17" X
18" and thickness we found out that this process is better then local
profile).
On each board 6 BGAs should be replaced (version upgrade). After replacing
the BGAs with the above process few other BGAs components were fail in away
that implementing force on the component makes it work properly. The X ray
inspection didn't show anything wrong with any of the solder joint. After
replacing the suspected components the boards pass all the functional test.
The failed components were plastic BGA.
Does any one familiar with that phenomena, I appreciate any help or advise.

Best Regards,  Tamir.

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