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Subject:	Antwort: [TN] Altera BGA Reflow Problem
From:	Frank Kriesch <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 30 May 2001 09:46:31 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (102 lines)

******* INFO: this is a copy of the original mail. Some of you might recieve this message now a second time. ***************

Hi Rick,

i just had a look at the Alterahomepage, because we want to use that part on a new board we are just designing.

The thermally enhanced type has a ceramic heatsink on to top, covering all the componentarea. The component is additionally
thicker (3.5 mm) than the typical -non enhanced- one (2.1 mm).

So I don't have any experience on working with that part. But may be the reason for your problems lies in the combination of
ceramic heatsink and organic substrate of the component.

So I like to ask the other techies about their experience using such components with ceramic heat sinks.

Frank Kriesch

mailto: [log in to unmask]
Web-Site: http://www.diehl.de http://www.diehl.com

Rick Thompson
<rthompson@VENTURAELECTR An: [log in to unmask]
ONICS.COM> Kopie:
Gesendet von: TechNet Thema: [TN] Altera BGA Reflow Problem
<[log in to unmask]>

23.05.2001 18:19
Bitte antworten an
"TechNet E-Mail Forum.";
Bitte antworten an Rick
Thompson

Hi,

We have an Altera fine pitch BGA that I'm having difficulty placing &
soldering. I'm hoping someone may have experience with this particular part
or can offer some suggestions. The part in question is an EP20K300 series
in a 'thermally enhanced' 672 ball package. Pitch is 1mm. The package looks
like an FR4 substrate with a layer of some sort of bonding material on top.
I think it's probably the same as the 'glob-top' material except it covers
the entire area of the part.

The problem we're having it that the part appears to be 'cupping' down at
the corners, causing shorts at the corners. Complicating this is the fact
we're placing this on .018" thick PCB's. I've looked at our profiles on
top and bottom and don't believe that the top is heating too much but we
still get the cupping effect.

Any experience with this chip or suggestions in general would be greatly
appreciated.

Thanks,

Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 x-304 voice
+1 (805) 584-1529 fax
[log in to unmask]

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