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May 2001

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 May 2001 09:42:05 +0200
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Hi Donn,

I once did a study on the effects of several drying methods. We did measurements of weight gain after a stay in a humidity chamber, and after baking. Maximum weight gain depended on board type, and was somewhere between 0.5 and 0.7 %. With a good balance this is very well measurable.
The moisture level that results in delamination was somthing we took over from existing literature, I think 0.4 % was used as a rule of thumb.
By the way, for daily operation I don't think it's very pratical do do these kind of tests. You have to make sure that it's exactly the same board that you measure before and after the process you're trying to monitor. 

Kind regards,

Daan Terstegge
Unclassified mail
Personal Website: http://www.smtinfo.net 

>>> "Steffen, Don E" <[log in to unmask]> 05/29 2:58 pm >>>
Technetters

Is there anyone out there in the TechNo world that has performed a
Weight Gain Test. I am deriving a Board Cleaning Spec and the amount of
moisture gain in the printed wiring boards is an attribute that I want
to track in order to minimizing the chances of "Popcorning" internal the
PWB. I do not want any delamination to occur since we are processing
material in multilayer.

Any help you can give me would be appreciated.

Donn E Steffen
Senior Quality Engineer
VDO Control Systems
Ph# 219-920-6052
Fax# 219-925-8710
Cell# 219-417-2926
Pager# 219-430-2826



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