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May 2001

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Subject:
From:
James Tingey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 May 2001 13:05:54 -0500
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I am beginning an evaluation of a no clean solder paste, and was looking
for some insight into particular tests.  What are some tests that you and
others perform?  How have you done evaluations on this in the past?  We are
looking for a paste that has a long wet paste window, and can be cleaned
easyily off of stencils and misprinted boards.

Thanks in advance.

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