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May 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 25 May 2001 11:12:14 +0800
Content-Type:
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Careful how you do that! The casings might pop open if the pressure isn't
lowered very gradually.

Pete Duncan





                    Guy Ramsey
                    <gramsey@ACIU        To:     [log in to unmask]
                    SA.ORG>              cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
                    Sent by:             Subject:     [TN] Moisture Sensitive Components
                    TechNet
                    <[log in to unmask]
                    ORG>


                    05/25/01
                    02:44 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
                    respond to
                    Guy Ramsey






Anyone out there ever considered dring moisture sensitive devices by
lowering the pressure in a storage vessle?

It is difficult to achieve 40 $B!k (BC and less than 5%RH when ambient RH is 50-60
percent. So, someone called and asked how long he would need to keep the
parts at a pressure equivelent of 80,000 ft above sea level, temperature at
room ambient to dry out parts.

No one here had considered it before. The physics made me feel like I was
at
altitude.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290

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