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Subject:	Re: ENIG in flex layers
From:	Steve Kelly <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 24 May 2001 16:57:48 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

If the nickel is on the copper trace under the covercoat in a bend area you
are in trouble. Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jindra, Larry
Sent: Thursday, May 24, 2001 3:16 PM
To: [log in to unmask]
Subject: [TN] ENIG in flex layers


Our rigid/flex vendor deposited immersion gold over electroless nickel on
internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid
board.  Our intent was to have ENIG finish only on the exposed connector
pads on the one end of the rigid/flex (6 layers).  Instead, the ENIG is on
the pads, on the flex, and continues on in internal to the other rigid
portion of the circuit board (10 layers).

I have concerns about the durability of the flex and the via stackup in the
10 layer rigid section, which now has nickel on layers 3 & 8.  Am I just
paranoid, or am I in trouble?

> Larry Jindra
> mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3940
>

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