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Subject:	Re: BGA
From:	Guy Ramsey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 24 May 2001 10:51:37 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (52 lines)

I would worry more about moisture absorption causing the package to fail. Do
you know the moisture sensitivity level of the component?

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Rick Howieson
Sent: Thursday, May 24, 2001 10:36 AM
To: [log in to unmask]
Subject: [TN] BGA


Need information on protecting BGA's not loaded. Should BGA's from a package
not used be sealed for the next run? If so, is this because the balls become
oxidized or ...?
Thanks,
Rick Howieson
Delta Group Electronics, Inc.

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