> Help!
>
> We are a proto shop only working with another board shop on an R&D project
> involving four (so far) different printed circuit board materials.  The
> substrate materials are not mixed with each other but the prepregs are a
> mixture of 1080 and same style , glass/epoxy, prepregs with less resin
> content.  These will be ten layer boards all using 5 mil substrates.
>
> We use a Plasma Etch Mk II-0 plasma etcher.  Would anyone have data for
> etching parameters of Park/Nelco N4000-6FC, Arlon 45N, GE - Getek and
> Rogers 4350B printed circuit board materials with 1080 prepregs?
>
> Just trying to get all available info that may exist to save time.  If I
> had a good baseline for each of these materials, it would help.  I talked
> to Arlon and they had parameters for an APS system but not for Plasma Etch
> system.  I have heard that different etchers behave much differently?
> Therefore assume cannot use APS instructions with a Plasma Etch machine?
> APS has up to 4 segments in the process and our etcher has only two.
>
> I have been able to get plasma recommendations for the Rogers material and
> prepregs from their website.  I basically need baseline parameters for the
> other three materials.  I need info on what gases to use along with gas
> mixtures and flow rates, Rf power to apply during plasma and oxygen burn
> segments (if used), time required for both segments?  What is the
> suggested pre-bake temperature and for how long?
>
> We have pretty much only used FR4 materials at our facility and don't have
> much experience with other materials.  We have worked with polyimide and
> Kevlar and some BT Epoxies but very limited.  We have used some Rogers
> materials but only in double-sided applications.
>
>
> Thanks for your time and consideration.
>
> Ed McAtee
> Naval Surface Warfare Center
> Phone:  (812)854-3892
> E-mail:  [log in to unmask]
> Fax:  (812)854-1174
>
>

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