Hi,

We have an Altera fine pitch BGA that I'm having difficulty placing &
soldering.  I'm hoping someone may have experience with this particular part
or can offer some suggestions.  The part in question is an EP20K300 series
in a 'thermally enhanced' 672 ball package. Pitch is 1mm.  The package looks
like an FR4 substrate with a layer of some sort of bonding material on top.
I think it's probably the same as the 'glob-top' material except it covers
the entire area of the part.

The problem we're having it that the part appears to be 'cupping' down at
the corners, causing shorts at the corners. Complicating this is the fact
we're placing this on .018"  thick PCB's.  I've looked at our profiles on
top and bottom and don't believe that the top is heating too much but we
still get the cupping effect.

Any experience with this chip or suggestions in general would be greatly
appreciated.

Thanks,


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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