TECHNET Archives

May 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Terry Munson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 22 May 2001 14:32:12 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Steve

We have seen this event before at CSL.  This appears to be a soldermask that
was was overcured at the fabricator and then more at wavesolder.  The
soldermask had poor adhesion to the copper ground areas and the temperature
cycle conditions created the loss of the soldermask by lifting and peeling
off.  The rings appear to come from the thermal effects on the copper
material from wave soldering. Look for soldermask flakes at the bottom of the
chamber.

Terry Munson

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2