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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 2 May 2001 10:19:31 +0800 |
Content-Type: | text/plain |
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> Hi All,
> I have problem to reflow thin plate (tab) of Ni200, the part easily peeled-off (<1kgf) for the soldering area of 3mx2mm.
> Not all the while I have such such problem. Only 20-50% of the certain lot of nickel plate.
> The Ni200 tab is tin platted elctrolitically, SEM check on the failure surface reveal the below % weight of element.
> At Component side,
> Nickel 12.4 [15.8]
> Sn 50.8 [51.95]
> Pb 9.7 [9.11]
> Cu 11.5 [10.3]
>
> At PCB pad side,
> Nickel 4.8 [6.6]
> Sn 63.4 [69.13]
> Pb 12.5 [10.35]
> Cu 8.4 [6.4]
>
> Composition of bad unit is [].
>
> Voids is relatively higher on the breaking surface of bad unit.
> Shall I say that the plating adhesion is still good since the breaking layer is not between tin plating to the Ni200 base material.
> Manual soldering does not have such problem (peeling force >3.5Kgf).
>
> Need advise/help/recommendation on the further analysis to be carried out.....
>
>
>
>
>
>
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