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May 2001

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Subject:
From:
Lee PengSoon-CPL035 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 May 2001 10:19:31 +0800
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> Hi All,
> I have problem to reflow thin plate (tab) of Ni200, the part easily peeled-off (<1kgf) for the soldering area of 3mx2mm.
> Not all the while I have such such problem. Only 20-50% of the certain lot of nickel plate.
> The Ni200 tab is tin platted elctrolitically, SEM check on the failure surface reveal the below % weight of element.
> At Component side,
> Nickel        12.4 [15.8]
> Sn    50.8 [51.95]
> Pb    9.7   [9.11]
> Cu    11.5 [10.3]
>
> At PCB pad side,
> Nickel        4.8   [6.6]
> Sn    63.4 [69.13]
> Pb    12.5 [10.35]
> Cu    8.4   [6.4]
>
> Composition of bad unit is [].
>
> Voids is relatively higher on the breaking surface of bad unit.
> Shall I say that the plating adhesion is still good since the breaking layer is not between tin plating to the Ni200 base material.
> Manual soldering does not have such problem (peeling force >3.5Kgf).
>
> Need advise/help/recommendation on the further analysis to be carried out.....
>
>
>
>
>
>

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