Colleagues,

If you are looking to submit an abstract for a paper presentation during the IPC Annual Meeting Technical Conference, Advancing into Tomorrow's HDI and Advanced Packaging Today, held on October 11-12 2001, now is the time!

This year's multi-track conference will host paper sessions relative to the following areas:

Advanced Packaging:
Embedded Technology
Opto-Electronics
Surface Finishes

HDI:
Fine Lines and Spaces
World Market Applications
Current carrying capacity and heat
Microvia Drilling Technology

If you'd like to submit an abstract for this years conference, please send to [log in to unmask] by June 1,2001.  For detailed information regading abstract and paper submittals for this technical conference, please see the attached Call For Papers.

Best Regards,




John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
[log in to unmask]

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