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May 2001

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Subject:
From:
Neda Thrash <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 May 2001 12:30:48 -0500
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** High Priority **

Hello everyone! I need help settling a dispute. I am aware of the fact that the pink foam designed for packing esd sensitive assemblies helps eliminate the possibility of a charge being generated during a transport while cushioning the product but I have an engineer telling me that the assemblies are safe if holding  the assembly in hand while ungrounded as long as the foam separates the hand at the point the pcb is held. If someone knows this to be true please send me more information on this because this contradicts what I have always been taught and what I am teaching. I need your help ASAP!

TIA, Neda

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