Main concerns are as follows:

- your assembly must be able to survive a longer soak period during reflow,
eg it won't do much good to melt your connector or change the frequency of
any crystals.  Measuring reflow temps is critical here.
- getting enough volume of solder paste to fill properly; you must have
enough space around each lead to overprint to get the required volume- paste
height increases alone will not be sufficient
- best results are usually achieved by designing assemblies and parts around
this process, and not trying to make an existing design into something for
intrusive reflow, although in some cases you can achieve excellent results.
- you will not always be able to achieve 100% fill or avoid voiding, in many
cases this is acceptable however, and you'll want to check against your
internal and external quality specs. what you can or can't live with.

this was pretty good, not sure if you can still view it or not, but I
believe they archive these little presentations on universal's website:

http://webevents.broadcast.com/cahners/oddform0301


good luck-  Bill C


-----Original Message-----
From: Kamalesh Dhaneshwar [mailto:[log in to unmask]]
Sent: Wednesday, May 16, 2001 5:12 PM
To: [log in to unmask]
Subject: [TN] Intrusive Soldering Reliability


Hello All,

I am looking for any data that is available comparing the solder joint
reliability of solder joints created through intrusive reflow to selective
soldering.

What are the typical processing concerns with Intrusive reflow methods?

Any input on these topics will be greatly appreciated.

Regards,

Kamalesh

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