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May 2001

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 May 2001 07:21:58 -0400
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Bob, take this for what it's worth...
On June 15, 1994, a report was issued from the Department of the Navy, Naval
Air Warfare Center, subject entitled "Testing and Evaluation of HF1189 and
HF1189A Soldering Fluxes on Stranded Wire".  The report goes on as follows:

"1.  As a result of concerns from several military program managers and
materials engineers; the Naval Air Warfare Center Weapons Division, China
lake, California, Hughes Missiles Systems, Tucson, Arizona, and Texas
Instruments Defense Systems and Electronics Group Missiles Systems,
Lewisville, Texas, formed a joint study team to address the issues regarding
the use of HF1189 and HF1189A water soluble soldering flux on stranded
wires.  The testing program was developed from the previous work found in
references (a) through (e) and input received from a variety of Navy, Army
and Air Force reliability, materials and product assurance engineers.  This
testing program was 21 days in duration under aggravated temperature and
humidity conditions with an applied electrical bias (50% duty cycle).
Detailed results of the testing are found in enclosures (1) through (3).

2.  The key issue in this task was to determine if flux which may become
trapped under the wire insulation from capillary action during soldering and
post-soldering cleaning operations will induce corrosion which will
negatively impact long term reliability.  Detailed metallurgical analysis of
the wires revealed no damaging corrosion or potential corrosion from these
fluxes and residues.  None of the data indicates that there will be any
problems with reliability or performance when stranded wires are soldered
with either of the subject fluxes.

3.  Foreign substances found on sole of the terminals were chemically
identified.  Detailed metallurgical analysis indicated that these residues
were benign.  No evidence of serious corrosion which would degrade wire of
terminal performance was found."


Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group (formerly known as AIL Systems)
[log in to unmask] <mailto:[log in to unmask]>

        -----Original Message-----
        From:   bbarr [SMTP:[log in to unmask]]
        Sent:   Wednesday, May 16, 2001 2:11 PM
        To:     [log in to unmask]
        Subject:        [TN] Rework Wires and OA Flux

        Since OA flux residues are corrosive if not removed, how does one
handle
        soldering rework wires to boards? Won't the flux wick under the
insulation
        and cause a problem? Assume I do not have the option of using a no
clean
        flux. Is my only choice an RMA chemistry with local cleaning (which
is an
        option I have available if needed)? Any other ideas?

        Thanks.


        Bob


        Robert Barr
        Manufacturing Engineering
        Formation, Inc.


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