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May 2001

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Subject:
From:
Jorge Rodriguez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 May 2001 17:42:01 -0700
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Of course water soluble solder pastes wet better, the flux on those things
is far more aggressive than what's on no-clean. That's actually the beauty
of water-soluble you can almost solder anything, that's why is so much
simpler process, although you have to wash, you don't have to worry too much
on the condition of the components or boards been dirty. No clean is a
better way of doing things, does not need to be washed, but you got to make
sure the process is very good.

My grain of salt

-----Original Message-----
From: Rick Thompson [mailto:[log in to unmask]]
Sent: Wednesday, May 16, 2001 5:04 PM
To: [log in to unmask]
Subject: [TN] No-clean vs Water-soluble wetting?


I've been having an ongoing discussion with our QA Manager regarding the
wetting capabilities of No-clean versus Water-soluble solder pastes.  He
believes that no-clean wets better, I think the opposite. This is in an air
reflow environment. I'm curious as to what some of you might have to offer
on the subject?

Thanks in advance,



Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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