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May 2001

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Subject:
From:
Francis Sun <[log in to unmask]>
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Date:
Tue, 1 May 2001 14:40:51 -0400
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Hello,

Is there a recommended ramp-up rate or guild line for pre-heating fluxed
assembles for through-hole selective soldering?
Reflow ramp-up is about 2C per second to 110-120C, I believe, for the
benefit of plastic package components.
Please let me know if I am mistaken.
Any feedback will be appreciated. TIA

Best Regards;
Francis Sun
MARK IV Industries
Mississauga, Ontario
Canada

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