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Date: | Tue, 1 May 2001 14:40:51 -0400 |
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Hello,
Is there a recommended ramp-up rate or guild line for pre-heating fluxed
assembles for through-hole selective soldering?
Reflow ramp-up is about 2C per second to 110-120C, I believe, for the
benefit of plastic package components.
Please let me know if I am mistaken.
Any feedback will be appreciated. TIA
Best Regards;
Francis Sun
MARK IV Industries
Mississauga, Ontario
Canada
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