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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 9 May 2001 10:33:27 -0700 |
| Content-Type: | text/plain |
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hi,
in case you haven't gotten a response to your problem, here's what i think. it's pretty well known that plating to passivated nickel will cause what you have seen. consequently, platers need to take special precautions to remove any passivation and then keep the nickel from passivating before the overplating process. doesn't seem that your vendor is able to do that consistently? you need to have a long talk with them.
phil
-----Original Message-----
From: Lee PengSoon-CPL035 [mailto:[log in to unmask]]
Sent: Tuesday, May 01, 2001 7:20 PM
To: [log in to unmask]
Subject: Re: [TN] Weak solderJoint - Part easily peel-off on Ni200
material
> Hi All,
> I have problem to reflow thin plate (tab) of Ni200, the part easily peeled-off (<1kgf) for the soldering area of 3mx2mm.
> Not all the while I have such such problem. Only 20-50% of the certain lot of nickel plate.
> The Ni200 tab is tin platted elctrolitically, SEM check on the failure surface reveal the below % weight of element.
> At Component side,
> Nickel 12.4 [15.8]
> Sn 50.8 [51.95]
> Pb 9.7 [9.11]
> Cu 11.5 [10.3]
>
> At PCB pad side,
> Nickel 4.8 [6.6]
> Sn 63.4 [69.13]
> Pb 12.5 [10.35]
> Cu 8.4 [6.4]
>
> Composition of bad unit is [].
>
> Voids is relatively higher on the breaking surface of bad unit.
> Shall I say that the plating adhesion is still good since the breaking layer is not between tin plating to the Ni200 base material.
> Manual soldering does not have such problem (peeling force >3.5Kgf).
>
> Need advise/help/recommendation on the further analysis to be carried out.....
>
>
>
>
>
>
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