Hi Steve,

I never had luck with the Uresolve(s) either.  I never had a problem
with Fuming Nitric acid. If you do the fuming nitric decap, you can
get by with little or any top metal degredation.  Most chips
(If the worked before hand!) will work after decapsulation.

Anyway, sounds like you're suspecting poor bonds. I'd get
the parts sent to a mailorder FA lab and spend a few bucks
and get a bond pull test done. What's the symptoms of the
failure, an open? Alternatively, call your rep in , and have
the vendor do a FA, and insist on quick turnaround. This could
be done in concert with plan "A" anyway!

I'd also be suspicious of packages where the encapsulant
pops off. Epoxy B is VERY tough stuff (for example, put
a DIP IC on the ground and hit it with a hammer....see what I mean?)
and should not spall off the substrate.

Here's to a technically rich Technet!

(And not afraid to use my name, which is:
     John Brewer)
     :-)

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