I second that opinion.  When we have multiple suppliers for the same part,
the ones that DON'T tombstone are the ones that fit the pad design most
closely.
While we need to maintain multiple sources for part availability, we do then
limit our AVL to those that don't give us the most grief during production.
It ends up a wash actually.  What works for one Customer's design doesn't
always work for the next Customer's design.

Jan Pelchat
Benchmark Electronics

> -----Original Message-----
> From: Busko, Wolfgang [SMTP:[log in to unmask]]
> Sent: Wednesday, May 09, 2001 7:20 AM
> To:   [log in to unmask]
> Subject:      [TN] AW: [TN] Lifted components (MELF Cylindrical Diodes)
>
> Alejandro,
>
> we saw similar Problems with MELF-diodes. The symptom occured randomly (
> we
> had about 50 of them on one board ) and found the most common thing for
> all
> was the paddesign. In changing that ( just made it as small as I thought
> it
> might be possible) solved this problem. Actually no more defects.
>
> Wolfgang
>
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