TECHNET Archives

May 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 May 2001 11:31:12 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Steve

No you are not supposed to be able to do that.
There is definitely no adhesion between the encapsulation and the wire bon pads. Regarding that you mentioned in your first mail that you want to look at the wire bond I assume that you had an open. After soldering?
Looks to me as if you see something similar we see quite often in BGA's: Delamination in the solder-process due to humidity. Its a failure of the popcorn family.

Have a great day

Guenter

Guenter Grossmann

Swiss Federal Institute for Materials Testing and Research EMPA
Centre for Reliability
8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :      xx41 1823 4054
mail:     [log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2