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May 2001

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Subject:
From:
Shabtay Shalev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 May 2001 11:09:42 +0200
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text/plain
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      Hello 

   I do not familiar with the application that you described, but if you are
speaking about big amounts & you have plasma equipment available it is nice
& clean process to remove resins & organic materials.

Shabtay
Eltek Process Engineering
Israel


> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: ג מאי 08 2001 23:39
> To:   [log in to unmask]
> Subject:      [TN] Removing Epoxy Encapsulation...
> 
> Hi ya'll!!
> 
> Thanks for all the suggestions for chemicals to remove epoxy encapsulation
> material.
> I had some Uresolve 411 here, but that won't work. Our customer has sent
> some
> parts to a failure analysis lab, and the vendor is doing some work on
> their
> end too.
> 
> I was looking at the parts under a microscope holding it with tweezers,
> and
> was gently scraping it with an x-acto knife, when the whole encapsulation
> just popped off! It wasn't any force at all!
> 
> I got a few more parts and found that I could very easily separate the
> whole
> glob off with hardly any force at all...like the encapsulation material
> wasn't bonded well to the substrate. I took a picture, go to:
> 
> http://stevezeva.homestead.com/index.html
> 
> You see the wire in the epoxy, and the silver epoxy for the die...but as
> you
> can see, the whole deal popped of very cleanly...are you supposed to be
> able
> to do that? Any ideas?
> 
> -Steve Gregory-   <----Flak jacket is on in case he slips and makes a
> joke...hehehe
> 
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