There is a company out there that supplies a piece of equipment for
doing exactly this, but can't remember what its called. Basically it
squirts a jet of concentrated acid, [another way of doing this which
uses an abrasive jet]. Both need some care. Suggest try contacting the
guys that supply wire/diebonders etc, they move in the s/c back end
and hybrid assembly worlds and are likely to be familiar with this
type of requirement. Alternatively just dunk in one of the solvents
already suggested and be p  a t  i  e  n t zzzz...


Mike


----- Original Message -----
From: "Stephen R. Gregory" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 08, 2001 5:11 PM
Subject: [TN] Removing epoxy encapsulation


> Hi ya'll!
>
> Could anybody tell me what kind of chemical/solvent I could use to
remove
> epoxy encapsulation material? What I'm trying to do is look at the
wire bonds
> on some failed tunnel diodes...
>
> Thanks!
>
> -Steve Gregory-
>
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