Hi  Alejandro!

Yes it could be possible, but you'd have to be breaking all the rules as far
as pre-heat, and solder pot temperature. I'd be willing to bet it's something
further back in the process...

I'm going to assume that you pretty much have your glue-deposition down, and
your cure profiles set-up (watch out for too fast a cure, as I learned
about...but that's another problem entirely).

It's been my experience (and this is not gospel...) that many times missing
bottomside components after wave, is because they were missing before they
went into wave...

Not that they were missing after SMT, but all the handling and whatnot that
the assembly goes through prior to wave (masking, stuffing the PTH
components, etc..), provides a BIG chance that components will get knocked
off if people don't handle the assemblies as the fragile creatures that they
are prior to wave...

Are you sure the components actually come off in wave solder? Or are you
being told that?

-Steve Gregory-

<< Hello to All,
 I have a question regarding to the adhesive used to hold SMD components
 prior to wave soldering.
 The problem consists in missing SMD components after wave soldering.
 Is it possible that the components fell down during the wave soldering
 process because of a high temperature of pre-heaters or solder?
 Thanks in advance

 Alejandro Becerra
 Quality Assurance
 (915)841-8439 >>

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