LISTSERV - LEADFREE Archives - LISTSERV.IPC.ORG

LEADFREE Archives

May 2001

Leadfree@IPC.ORG

	LISTSERV Archives
	LEADFREE Home
	LEADFREE May 2001

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Lead free component with SnPb paste
From:	Quyen Chu <[log in to unmask]>
Reply To:	Leadfree Electronics Assembly E-Mail Forum.
Date:	Thu, 31 May 2001 17:49:45 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hello Everyone.

Longtime reader, first time writer.

I am looking for some insights as to the solder wetting and long term
reliability of Eutectic solder paste adhering to Pb-free component(ie end
termination plated w/ CuSnAg).  I am looking for effects in SMT process, PHT
process, and reworking aspect.  If there are any thoughts/paper references
it would be much appreciated.

Thanks

qc

---------------------------------------------------------------------------------
Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG