LEADFREE Archives

May 2001

Leadfree@IPC.ORG

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Subject:
From:
Keach Sasamori <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 30 May 2001 09:13:39 -0500
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Posting for Kay Nimmo:

From: "Kay Nimmo" <[log in to unmask]>
To: "Leadfree Electronics Assembly E-Mail Forum." <[log in to unmask]>

The ISO 9453 standard defines specific composition ranges for each alloy
rather than general tolerances; e.g.=20

Sn-5Sb can have 4.5 to 5.5%Sb
Sn-4Ag can have 3.5 to 4.0%Ag
Sn-1Cu can have 0.45 to 0.9%Cu

I imagine these composition ranges were set to limit significant changes
to liquidus/solidus. Newer lead-free alloys are in the process of being
added to the standard.=20

Kay Nimmo


-----Original Message-----
From: Lynn Norman [mailto:[log in to unmask]] 
Sent: 29 May 2001 17:03
To: [log in to unmask] 
Subject: [LF] Lead-free tolerances


We're starting our in-house evaluation of lead-free solder.  The
composition
we are initially looking at is 95.5Sn-3.8Ag-0.7Cu.  Our current spec for
SnPb has a +/- tolerance of 0.5% on the composition.  What kind of
tolerance
will the lead-frees have?  How much of an effect will the variability
have
on solidus/liquidus temperatures?  Just curious as to what others are
doing.

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