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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 3 May 2001 15:10:09 -0400 |
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Hi Kathy:
Essentially, the entire back of the PCB is solid gold plating. There are
only 2 small .060"x.060" I/O pads that are on the reverse of the board near
some side edges. These I/O pads have 1/2 vias (plated) going up to the top
of the board where identical I/O pads exist making contact with the top
components. There are various ground vias around the board. Of course, the
I/O pads are isolated from the ground pad(s) by bare FR-4.
I don't have any pics, but if you go to this link (Spectrum Control, Inc.
Wireless/RF filters), I think you will get the idea..
http://www.spectrumcontrol.com/pdfs/wcpg62-64.pdf Page 3, configurations
"A"~"D". Each one is essentially the same.
Some of our other non-standard boards have full vias in various places
linking the top and bottom ground pads. One idea is to simply put solder
mask around just about every 1/2 or full thru plated via.
Tnx
Matthew Steger
Product Design Engineer
RF/Microwave Products
Spectrum Control, Inc.
Phone: 717-361-4842
Fax: 717-361-4756
Email: [log in to unmask]
Mailing Address: 1595 S. Mt Joy St., Elizabethtown, PA 17022
-----Original Message-----
From: Kathy Kuhlow [mailto:[log in to unmask]]
Sent: Thursday, May 03, 2001 2:31 PM
To: [log in to unmask]
Subject: Re: [TN] IPC standard for solder content on the back of PCBs?
Can you put a photo out of the pad layout with the via connect? That may
help in determining any suggestions.
TIA
Kathy
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