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Thu, 24 May 2001 15:42:46 -0700 |
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Steve,
Not necessarily. It depends on the tension of the nickel. A well controlled nickel bath will
not yield brittle circuits.
Chuck Brummer
Steve Kelly wrote:
> If the nickel is on the copper trace under the covercoat in a bend area you
> are in trouble. Steve Kelly
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jindra, Larry
> Sent: Thursday, May 24, 2001 3:16 PM
> To: [log in to unmask]
> Subject: [TN] ENIG in flex layers
>
> Our rigid/flex vendor deposited immersion gold over electroless nickel on
> internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid
> board. Our intent was to have ENIG finish only on the exposed connector
> pads on the one end of the rigid/flex (6 layers). Instead, the ENIG is on
> the pads, on the flex, and continues on in internal to the other rigid
> portion of the circuit board (10 layers).
>
> I have concerns about the durability of the flex and the via stackup in the
> 10 layer rigid section, which now has nickel on layers 3 & 8. Am I just
> paranoid, or am I in trouble?
>
> > Larry Jindra
> > mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3940
> >
>
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
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