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Thu, 24 May 2001 12:16:11 -0700 |
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Our rigid/flex vendor deposited immersion gold over electroless nickel on internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid board. Our intent was to have ENIG finish only on the exposed connector pads on the one end of the rigid/flex (6 layers). Instead, the ENIG is on the pads, on the flex, and continues on in internal to the other rigid portion of the circuit board (10 layers).
I have concerns about the durability of the flex and the via stackup in the 10 layer rigid section, which now has nickel on layers 3 & 8. Am I just paranoid, or am I in trouble?
> Larry Jindra
> mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3940
>
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