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Tue, 15 May 2001 08:28:39 -0700 |
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Jim...far from muddy, Frank has this one right. The dense pile
construction of Duroid leaves a stringy edge after de-panelization. It
also requires a reduced web spec to avoid stress fracturing at the part
edge. We have done some of pwav's work....Frank is the maven on this one.
Mark Simmons
Marsico, James wrote:
> Hello Technet... a quick question. Are Teflon boards (Duroid) a good
> candidate for scoring? What would be the best method for panelized assembly
> and singulation?
> Thanks in advance,
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
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