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Subject:	Re: AuSn soldering on Silver
From:	"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 6 Apr 2001 16:53:41 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Hi Roadrunner,
thx for reply. I'm not  happy as you understand. Well known big semi maker puts this on backside of the powerFET discs, but they have no mounting instruction. I don't at all understand why Silver! I'll try to find tripleE paper. Will tell you end of story later.
By the way, my BGA soldering report is on CD in a few days, will send it next oeec to you and George W and a few that supported me.
Have a nice night in your Cherokee
Ingemar


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: den 6 april 2001 13:44
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] AuSn soldering on Silver


Hi Ingemar,
Actually, should have no trouble finding the dissolution rate of Ag in Sn in
Klein-Wassink; if I recall correctly it is even faster than Au. I have no
idea whether this holds for 80AuSn, but it is not likely that you will be
soldering to Ag. In 1982, TI Ag-plated PLCC J-leads with Ag--these components
fell off the PCBs at IBM-Austin with bed-of-nails board bending. so Ag-based
IMCs are at least as brittle and weak as Au-based IMCs.
This Ag-plating problem was the reason for the formation of the IEEE
Compliant
Leads Task Force, chaired by Jack Balde, and you can find some papers on our
work in the 1983-89 time frame.
You sure have your troubles--who is coming up with all these exotic
metallizations?
Good luck.

Werner Engelmaier

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