Hi Ingemar,
Actually, should have no trouble finding the dissolution rate of Ag in Sn in
Klein-Wassink; if I recall correctly it is even faster than Au. I have no
idea whether this holds for 80AuSn, but it is not likely that you will be
soldering to Ag. In 1982, TI Ag-plated PLCC J-leads with Ag--these components
fell off the PCBs at IBM-Austin with bed-of-nails board bending. so Ag-based
IMCs are at least as brittle and weak as Au-based IMCs.
This Ag-plating problem was the reason for the formation of the IEEE
Compliant
Leads Task Force, chaired by Jack Balde, and you can find some papers on our
work in the 1983-89 time frame.
You sure have your troubles--who is coming up with all these exotic
metallizations?
Good luck.

Werner Engelmaier

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