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April 2001

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Apr 2001 17:53:51 EDT
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Hi Ioan!

Are you seeing this problem on every single board, or on random ones? I've
run into something similar before in the past...

It all went back to our operators. Seems that when they found a board that
had glue problems before populating it, they would take a kim-wipe and wet it
with alcohol to clean the glue off and re-run the board again, instead of
sending the board through the automated cleaner where it would be cleaned
thoroughly.

Just wiping the board off doesn't cut it...you may visually look at it and it
may appear that all traces of glue have been removed, but there will still be
a very thin coat that's
practically invisible that will prevent solder from wetting during wave.
You'll be able to hand solder it fine when you stick a 700-degree soldering
iron to cause it'll burn right through it.

Seen exactly the same things as you when it was happening to me in the past.
One pad would solder and the other one wouldn't...the one that didn't
depended on which direction the operator had used when he wiped the board
off...and sometimes the glue would get on both pads, or on locations where
there wasn't any components and the solder wouldn't wet...

Your situation sounds suspiciously like mine...

-Steve Gregory-

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