TECHNET Archives

April 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Mike Fenner <[log in to unmask]>
Date:
Wed, 4 Apr 2001 22:31:12 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
Try Indium Corporation Utica NY
 www.indium.com


Mike

----- Original Message -----
From: "Jonathan A Noquil" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, April 04, 2001 11:41 AM
Subject: [TN] Solder Paste Vendor


> Can anybody recommend a solder paste vendor
> with the following compostion:
>
> 1.             15Sn/82.5Pb/2.5Ag             85 % metal loading (For
> Dispensing - 500 +635)
> 2.              5Sn/93Pb/2Ag.                     85 % metal loading
(For
> Dispensing  -500 + 635)
>
> I need this paste for our manufacturing.
>
> Thanks for your help

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2