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April 2001

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Subject:
From:
Shawn Murphy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Apr 2001 10:21:19 -0700
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Bow and Twist from the fab house might be a result of the packaging
technique ie. Shrink wrap.  If the warping is occuring in your process it
might be thermal related.  Can you give more detail on where you are
identifing the problem ie incomming inspection or in process.


Shawn  C. Murphy
Process Engineer

6640 185th Ave NE
Redmond, WA 98052-5038
[log in to unmask]
Tel: (425) 885-0107 Ext. 678
Fax: (425)867-5600


 -----Original Message-----
From:   [log in to unmask] [mailto:[log in to unmask]]
Sent:   Wednesday, April 04, 2001 10:02 AM
To:     [log in to unmask]
Subject:        [TN] BOW AND TWIST

Hello fellow Technetters

I would like to know if anyone has had problem with bow and twist on
.062 thick boards.
what is the main cause of bow and twist.
Is this problem more related to bare board fab or component assembly?
What was the solution to keep the boards within the IPC specs?

Thanks in advance
Carl.
Ectronics

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