Hello Technetters,

I am soon to design a PB for one of our customers that will be required to
withstand a shock load of approximately 1500 g's.
Does anyone have any guidelines or advice on how to achieve this?
I'm thinking of solid potting the assembly within a rigid structure as one
solution.
Components are expected to include SMD discretes and BGAs.
Of course there's the consideration of how hard the potting compound needs
to be and what it should be (epoxy, silicone elastomer), as well as what
material the board should be made of, CTE considerations between the board -
components - compound - housing etc.
Any advice would be most welcome.


Phil Dutton C.I.D.
Senior CAD Technician
IPC Certified Interconnect Designer

Tenix Defence Systems Pty Ltd
Systems Division - Adelaide
Second Avenue, Technology Park,
Mawson Lakes.  SOUTH AUSTRALIA  5095

================================
Phone   (08) 8300 4400 (reception)
        (08) 8300 4481 (direct)
Fax             (08) 8349 7420
email           [log in to unmask]
Internet Page   http//www.tenix.com
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