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April 2001

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Subject:
From:
"Smith-BCD, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Apr 2001 14:57:40 -0500
Content-Type:
text/plain
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text/plain (77 lines)
Hi Patrick,

Practically anything can be built by a willing assembler as long as the pads
don't overlap. I didn't see an attachment but here are some things to
consider.

Cost
Performance
Inspectability
Testability
Component height
Side of board
Solder process(es)
Solder type
Thermal
Cleaning
Screening (paste, soldermask)
Rework-ability



Rick Smith
CAD Supervisor
ADC Broadband Infrastructure & Access
Wallingford, Ct. 06492
Ph 203 639 7670
FX 203 639 7601

Learn about ADC-The Broadband Company at www.adc.com



-----Original Message-----
From: Lam, Patrick [mailto:[log in to unmask]]
Sent: Tuesday, April 24, 2001 12:26 PM
To: [log in to unmask]
Subject: [TN] Minimum Spacing For SMD


Hi all,

We need to pack all the components as close to each other as possible onto
both sides of the board. Please share your knowledge on how to determine the
minimum spacing for a manufacturable design. Please give feed back to the
spacings(attached table in inches)we are using. Please tell me which ones
can go tighter?!

Thanks,

Patrick Lam
Phone:(604)293.4392

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