Dictum factum, as they say in Northumbria when the cows go mad on the pub, and can't see the difference between Isle of Jura and Johnny Walker. If you are so alert, Mike, perhaps you can also give me the recipe for best etching away Nickel without damaging Titanium. Is wet possible at all? I'm trying to find ESD damages in the dielectric of 0.5x0.5 mm MOS caps. Have removed bond gold, and want remove 1000 A nickel without taking underlying Titanium simultaneously. Step- by- step analysis is important in this case. Top of the selective etch list for Ni, Pt, Cr and Ti would be grate. I have experimented with most common acids, but not found really good selective soups. I don't talk fine etching for grain studies but stripping.
Ingemar
PS. No,Mike, milk did not work so good.
-----Original Message-----
From: Mike Fenner [mailto:[log in to unmask]]
Sent: den 24 april 2001 09:03
To: TechNet E-Mail Forum.; Ingemar Hernefjord (EMW)
Subject: Re: Re: [TN] Embrittlement
Stannum
Mike
----- Original Message -----
From: "Ingemar Hernefjord (EMW)" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, April 24, 2001 7:31 AM
Subject: Re: [TN] Embrittlement
> another one falling into #2 is me. Gold is Aurorum, Silver is
Argentum, Lead is Plumbum, but what was Sn? Was it Senilium? /Ingemar
>
> -----Original Message-----
> From: Wenger, George M (George) [mailto:[log in to unmask]]
> Sent: den 23 april 2001 19:46
> To: [log in to unmask]
> Subject: Re: [TN] Embrittlement
>
>
> Bev,
> It's only a tough question if 1). You didn't have a metallurgy
course or 2).
> you start to get old and forgetful. I didn't take #1 but I know a
lot about
> #2. I think Dave, like the rest of us, is starting to fall into #2.
>
> I think he meant to tell you AuSn4 and AgSn3 not Au4Sn and Ag3Sn
>
> Regards,
> George
> George M. Wenger, DMTS Bell Laboratories Princeton
> Supply Network Solutions
> PO Box 900, Princeton NJ 08542-0900
> Route 569 Carter Rd., Hopewell, NJ 08525
> (609)-639-2769 (Office), 3210 (Lab), 2346 (Fax)
> [log in to unmask]
>
>
> -----Original Message-----
> From: David Hillman [mailto:[log in to unmask]]
> Sent: Monday, April 23, 2001 12:54 PM
> To: [log in to unmask]
> Subject: Re: [TN] Embrittlement
>
>
> Hi Bev! There is a fairly large set of industry data on the solder
joint
> reliability problems induced by Gold/Tin intermetallic (Au4Sn)
formation
> and a smaller data set on the solder joint reliability problems
induced by
> Silver/Tin intermetallic (Ag3Sn) formation. See Klein Wassink's
book ISBN
> 0-901150-24-X. I would expect that if you have both intermetallic
species
> in a solder joint it just would not be a "good" thing. The use
environment
> of the assembly would also play a role in just "how much"
intermetallic
> degradation would be allowable. Tough question - good luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Bev Christian <[log in to unmask]>@IPC.ORG> on 04/16/2001 08:33:58
AM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
> to Bev Christian <[log in to unmask]>
>
> Sent by: TechNet <[log in to unmask]>
>
>
> To: [log in to unmask]
> cc:
>
> Subject: [TN] Embrittlement
>
>
> Good morning!
> Here is a met. question to start off the day.
>
> We know that if we have over 4% gold in a 63/37 tin lead solder
joint we
> risk gold induced embrittlement because of the production of a
significant
> amount of the tin/gold intermetallic. It is also common practise to
use a
> slight variation of the eutectic solder with a 62/36/2 Sn/Pb/Ag
> composition.
> We also know that gold and silver are 100% soluble in each other.
My
> question: if the final tin/lead based solder joint composition has a
> COMBINED noble metal percentage in the 4% range how bad is that for
solder
> joint reliability?
>
> regards,
> Bev Christian
> Research in Motion
>
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