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April 2001

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Apr 2001 16:09:26 -0500
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Hi Glenn! One metallography trick you may want to try is to "load" your
mounting compound with ceramic filler. We do this about 50% of the time on
our FC cross sections. Most of the metallography suppliers offer a ceramic
filler as a standard consumable product. This methodology doesn't help on
the brittle die issues but it does increase the overall "hardness" of the
mount which decreases the tendency of the softer materials polishing faster
than the harder materials. It also causes you to go through silica
paper/diamond polish at a much faster rate. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





"Pelkey, Glenn" <[log in to unmask]>@IPC.ORG> on 04/23/2001 01:29:59
PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Pelkey, Glenn" <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Flip Chip Sample Preparation for Cross Section


Hi all,

        What methods have any of you used for cross sectioning flip chip
BGAs?

        We have a large flip chip die, attached to a thin interposer, and
want to inspect the inside die bumps/joints.  Our concern is with the
brittle nature of the die and the lack of good support during the
sectioning
operation.  The current option is to cut next to the die, mount sample in
epoxy, and use 0.3 micron alumina for a very slow polish to the area of
interest.  Hopefully, somebody out there has dealt with this before and has
a better idea.

Thanks for all your help,

Glenn

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