TECHNET Archives

April 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Apr 2001 10:26:04 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines)
Are the vias being used as test points?
if they are then you would not want them to be tented. Have you asked the
customer why they are so resistant to changing there design?

Ted

-----Original Message-----
From: Rick Thompson [mailto:[log in to unmask]]
Sent: Thursday, April 19, 2001 9:46 AM
To: [log in to unmask]
Subject: [TN] Vias under BGA's - Tented or Not??


Hi,

We're running several designs from a new customer with multiple BGA's. The
boards are laid out such that the vias under the BGA's are not soldermask
tented on either side.  Our experience with this type of layout is for a
greater tendency to bridge as well as requiring the bottom side to be masked
prior to any wave solder operation.  The customer is resistant to changing
this layout but I'd like to get some other opinions.

My questions are: What are others doing in terms of PCB layout of BGA's? Is
the above layout common? What if any trends are there in the industry for
these types of layout?

Thanks in advance for any insights.



Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2