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April 2001

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Subject:
From:
Rich Lasko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Apr 2001 08:40:38 -0500
Content-Type:
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Good morning everyone!

I am currently investigating a customer return due to suspected shipping
damage.  Two components in particular have been damaged.  One component is a
SMT bridge rectifier (DF06S) on the primary side of the assembly.  This side
uses solder paste and is reflowed.  The other component is a SMT diode
(DL4007) on the secondary side of the assembly.  This side is glued and wave
soldered.  The returned assemblies have either one or the other of the above
components "torn" or "partially torn" from the pcb.  Torn includes the
component, component pad, and attached trace(s) that have been dislodged
from the pcb.  Both components are located near the edge of the pcb.  It
would appear that this type of damage would take quite a bit of force to
dislodge a low profile SMT component from the pcb with the pads and traces
attached.  The shipping boxes nor static shielding bags appear to have been
"excessively" damaged.  (No apparent holes, punctures, etc...).  Each
assembly is bagged separately in a static shielding bag and packaged in
individual "slots" in the shipping box.  The board size is approx. 4" x 4".

My questions are these:

1.) Has anyone else experienced this type of damage to low profile SMT
components?  If so, what was the cause and resolution?
2.) Does anyone have an idea on how much force would be needed to dislodged
these type components from the pcb?



Please advise.

Thanks in advance for your responses.

Rich Lasko
Badger Electronics

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