Hi Alex!

Do you really mean .005"? Sounds pretty 'friggen tight to me. Here's a page
that talks about ball pitch on uBga packages and chip scale packages:

http://www.ednmag.com/ednmag/reg/1995/052595/11df1.htm

No where are they getting that tight...I just want to say, I see you're from
Alcatel, so you're in the packaging business, have a heart on us assembly
guys, you may design a package that works, but then leave it up to
"floor-rats" like us to figure out how to put these things together. A BGA
package that goes down to .005" spacing is asking too friggen' much!!! I
don't think I'm alone in that observation....I could be wrong...(it hasn't
been the first time)

Geeze, you designers need to get down on the manufacturing floor...don't mean
that badly, just a necessary requirement before you push the limits...

-Steve Gregory-

<< Hi,

 Do anyone have any literature referring to what is the minimum spacing
 between two BGA solder joints?  From talking to many people, 0.005" seem

 to be the most commonly use number.  Do people agree with this number?
 Why?

 Thanks,
 Alex >>

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