"Help! Still on the road" wuzzindat a Willie Nelson song?
Hoping I've interpreted your requirement properly, my intent in providing
these selections is to provide references that someone could use to better
understand fatigue mechanisms that occur in solder connections.
For straight forward, down to earth, lay-person's language try:
Soldering In Electronics; R. J. Klein Wassink; Electrochemical Publications
[Telephone: +44 (0)1624 834941 http://www.elchempub.com]; 2nd Edition; ISBN
0 901150 24 X; p. 185-194.
For more detailed, analytical tact try:
Solder Mechanics, A State Of The Art Assessment; D.J. Frear, et al; The
Minerals, Metals, Materials & Society [Telephone: 724-776-9024
http://www2.tms.org/ ]; ISBN 0 87339 166 7; Ch 3
Turning back from things that make most scratch their head too much, try:
A Scientific Guide To Surface Mount Technology; C. Lea; Electrochemical
Publications [Telephone: +44 (0)1624 834941 http://www.elchempub.com]; ISBN
0 901150 22 3; p. 396-407
Completing a Electrochemical trifecta from an approachability stand-point .
A Comprehensive Guide To The Design And Manufacture Of Printed Board
Assemblies - Volume 1; W. Macleod Ross; Electrochemical Publications
[Telephone: +44 (0)1624 834941 http://www.elchempub.com]; ISBN 0 901150 32
0; p. 650-666
Good luck. If this meet your needs, let's restart.
Dave Fish
----- Original Message -----
From: Werner Engelmaier <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 13, 2001 9:16 PM
Subject: [TN] Help! Still on the road
> Hi TechNetters,
> I need your help once again [thanks to all on the MP of steel--it was
exactly
> what I needed]; this time I need a text book that explains the difference
in
> solder behavior due to creep and its property changes [like modulus
decrease]
> due to temperature increases in good layman's terms. I am thinking of
> Klein-Wassink, Lea, Frear, Lau ed. (Solder Joint Reliability).
>
> Werner Engelmaier
>
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