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April 2001

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Apr 2001 09:33:58 -0400
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Good morning!
Here is a met. question to start off the day.

We know that if we have over 4% gold in a 63/37 tin lead solder joint we
risk gold induced embrittlement because of the production of a  significant
amount of the tin/gold intermetallic.  It is also common practise to use a
slight variation of the eutectic solder with a 62/36/2 Sn/Pb/Ag composition.
We also know that gold and silver are 100% soluble in each other.  My
question: if the final tin/lead based solder joint composition has a
COMBINED noble metal percentage in the 4% range how bad is that for solder
joint reliability?

regards,
Bev Christian
Research in Motion

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