Can I have solder bridging two SM rectangular chip components due to
misalignment? The bridging occurs at one end and is on a common trace
between the two pads. The components are larger than the pad (side
overhang) and are aligned rather perfectly when placed in the solder
paste. The amount of misalignment is well within the limitations of 610C
and HDBK-001 and I am not violating minimal electrical spacing
requirements.

Douglas A. Hooper, Sr.
Luminescent Systems Inc.
130 Commerce Way
East Aurora, NY 14052
7166550800 x163
7166550309 FAX
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